At UniSCool, we have patented and developed a cutting-edge thermal management solution—Smart Cool Fins, a breakthrough in direct-to-chip liquid cooling. This innovation stems from 10+ years of research at the University of Lleida (Spain) and University of Sherbrooke (Canada), with over €500,000 invested. Additionally, Smart Cool Fins has been recognized as a top innovation by the European Innovation Radar.
Smart Cool Fins utilize self-adaptive fins, which dynamically adjust to optimize heat extraction in response to changing thermal loads in time and space.
Our advanced cooling system maximizes energy efficiency, cutting power consumption by up to 60% while dissipating up to 2000W per socket. It mitigates hotspots, ideal for embedded systems and high-performance applications, while its adaptive cooling optimizes heat extraction for variable loads, ensuring uniform temperature distribution.