As AI and HPC grow, CPUs and GPUs generate more heat, challenging data centers consuming 3% of global electricity, with up to 40% used for cooling. Rising power density demands high-performance cooling, leading customers to single-phase, direct-to-chip (DTC) liquid cooling for smarter efficiency and sustainable performance.
UniSCool outperforms competitors, reducing cooling consumption by 70% for unmatched energy savings.
Achieve up to 70% energy savings over other direct-to chip liquid cooling systems as Microchannels and Jet Impingement cooling.
Dissipate up to 2000W of power efficiently with our advanced liquid cooling technology.
Develop next-generation chipsets with integrated in-silicon cooling, ensuring optimal thermal performance.
Enhance EV performance and battery lifespan with advanced liquid cooling for electric mobility.
The increasing power of AI demands advanced thermal management. UniSCool’s liquid cooling solutions ensure peak performance, energy efficiency, and reliability—unlocking the full potential of AI.
At UniSCool, we offer a plug-and-play system that enables an easy transition from conventional cooling to liquid cooling. Our technology delivers up to 70% energy savings compared to advanced cooling methods like microchannels or jet impingement.
The project DESARROLLO DE UN NUEVO SISTEMA DE ENFRIAMIENTO LÍQUIDO INTELIGENTE PARA SISTEMAS MICROELECTRÓNICOS has been funded by CDTI.