UniSCool - Universal Smart Cooling
UniSCool - Universal Smart Cooling
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  • Más
    • Home
    • Technology
    • Products
      • Smart Cool One
      • Smart Cool Plus
      • Smart Cool Fins
    • Services
      • Try & Buy
      • Custom solutions
      • Data centers & AI
      • In-chip silicon cooling
    • Aplications
      • AI & HPC
      • Data centers
      • Semiconductors
      • Electrical Vehicles
    • Company
      • About us
      • Contact
      • Careers
  • Home
  • Technology
  • Products
    • Smart Cool One
    • Smart Cool Plus
    • Smart Cool Fins
  • Services
    • Try & Buy
    • Custom solutions
    • Data centers & AI
    • In-chip silicon cooling
  • Aplications
    • AI & HPC
    • Data centers
    • Semiconductors
    • Electrical Vehicles
  • Company
    • About us
    • Contact
    • Careers

In-chip Silicon Colling

UniSCool & STREAMS Pioneering Embedded Cooling Solutions

 UniSCool was founded thanks to a patented technology developed as part of STREAMS, a European research project focused on embedded thermal management solutions integrating cooling systems with silicon. STREAMS aimed to revolutionize heat dissipation in advanced electronics, paving the way for high-efficiency, compact, and scalable cooling technologies.

 At UniSCool, we develop and customize this technology for our clients, leveraging our patented innovations. Our fully scalable solution adapts seamlessly to power electronics, AI, EVs, and beyond.

We push the boundaries of embedded cooling, delivering tailored solutions for the most demanding thermal challenges. For more details on how UniSCool can support your needs, feel free to contact our team. 

Contact us for a customized embedded colling solution!

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