UniSCool’s In-Rack cooling solution integrates all our advanced thermal management products. Featuring a Coolant Distribution Unit (CDU) with a hydraulic system and a manifold for precise coolant distribution, it ensures maximum efficiency. Our dry break quick connectors guarantee a clean, hassle-free installation with minimal downtime. Tested for 5 months, this solution delivers proven performance, backed by our expert support and maintenance.
UniSCool’s In-Server plug and play solution takes liquid cooling to the next level by fully integrating the hydraulic circuit within the server itself.
To make adoption seamless, we offer a Try and Buy program: clients can test the solution with a pre-integrated server provided by UniSCool at no cost. After three months, they can decide whether to purchase it—risk-free and with real-world performance validation.
Direct-to-chip liquid cooling, tested and standarized in real-world data center & AI environments, offers high heat extraction capacity, ensuring optimal thermal performance for high-power computing systems.
Patented self-adaptive fins optimize heat extraction in variable thermal conditions, enhancing temperature uniformity and reducing up to 70% cooling energy consumption regarding Skiving Microchannels and Jet Impingement technologies.
An adaptive system capable of optimizing local heat extraction on the device depending on the
thermal load scenario, delivering up to 65% energy savings in comparison to Skiving Microchannels and Jet Impingement technologies.