UniSCool - Universal Smart Cooling
UniSCool - Universal Smart Cooling
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    • Try & Buy
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    • Data centers & AI
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    • Data centers
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  • Más
    • Home
    • Technology
    • Products
      • Smart Cool One
      • Smart Cool Plus
      • Smart Cool Fins
    • Services
      • Try & Buy
      • Custom solutions
      • Data centers & AI
      • In-chip silicon cooling
    • Aplications
      • AI & HPC
      • Data centers
      • Semiconductors
      • Electrical Vehicles
    • Company
      • About us
      • Contact
      • Careers
  • Home
  • Technology
  • Products
    • Smart Cool One
    • Smart Cool Plus
    • Smart Cool Fins
  • Services
    • Try & Buy
    • Custom solutions
    • Data centers & AI
    • In-chip silicon cooling
  • Aplications
    • AI & HPC
    • Data centers
    • Semiconductors
    • Electrical Vehicles
  • Company
    • About us
    • Contact
    • Careers

Smart Cooling for Data Center & AI

In-Rack Solution

UniSCool’s In-Rack cooling solution integrates all our advanced thermal management products. Featuring a Coolant Distribution Unit (CDU) with a hydraulic system and a manifold for precise coolant distribution, it ensures maximum efficiency. Our dry break quick connectors guarantee a clean, hassle-free installation with minimal downtime. Tested for 5 months, this solution delivers proven performance, backed by our expert support and maintenance. 

In-Server Solution

 UniSCool’s In-Server plug and play solution takes liquid cooling to the next level by fully integrating the hydraulic circuit within the server itself.

To make adoption seamless, we offer a Try and Buy program: clients can test the solution with a pre-integrated server provided by UniSCool at no cost. After three months, they can decide whether to purchase it—risk-free and with real-world performance validation.

Our Products

Smart Cool One

Smart Cool Fins

Smart Cool Fins

 Direct-to-chip liquid cooling, tested and standarized in real-world data center & AI environments, offers high heat extraction capacity, ensuring optimal thermal performance for high-power computing systems. 

Smart Cool Fins

Smart Cool Fins

Smart Cool Fins

Patented self-adaptive fins optimize heat extraction in variable thermal conditions, enhancing temperature uniformity and reducing up to 70% cooling energy consumption regarding Skiving Microchannels and Jet Impingement technologies.

Smart Cool Plus

Smart Cool Fins

Smart Cool Plus

An adaptive system capable of optimizing local heat extraction on the device depending on the

thermal load scenario, delivering up to 65% energy savings in comparison to Skiving Microchannels and Jet Impingement technologies.

Contact us for more information!

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